chip bonding meaning in Chinese
芯片焊接
芯片接合
Examples
- Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术 - Flip - chip bonding technology
的柔性凸点技术 - Design and realization of machine vision system in thermosonic flip - chip bonder
热超声倒装键合机视觉系统的设计与实现 - For the problem of poor cohesion and the difficult process follow - uply , such as mount the components in the ltcc substrate . besides , it ' s easy to short circuit between each electrode because of the small size of chip . we carried on the experiment of mount components and chip bonding
针对ltcc基板布线附着性较差，贴装元器件等电路后续加工困难，布线容易脱落和管芯尺寸小，键合时各级之间容易短路的问题，进行ltcc基板后续贴装和管芯键合工艺实验。 - In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
本文针对倒装贴片机的自动对准系统开展了以下几方面的工作:首先在讨论了现有的对准方法和自动贴片机的对准光路系统基础上,针对贴片机实际应用环境,提出基于多点自动对焦的芯片调平方法。